The principle of PVD 3D series coating machine is mainly based on physical vapor deposition (PVD) technology, which is a technology that uses physical methods to convert solid materials (targets) into gaseous atoms, molecules or ions in a vacuum environment, and deposits them on the substrate surface to form a thin film. PVD technology includes two main processes, evaporation and sputtering, both of which are carried out in a high vacuum environment to ensure the purity and adhesion of the film. Evaporation process: Solid materials are heated by a heating source to sublime them into a gaseous state, and then deposited onto the surface of the substrate in a vacuum chamber to form a thin film. This method can use electron beam or resistance heating to heat the target material until it evaporates, and the evaporated atoms or molecules are deposited on the substrate in vacuum. Sputtering process: Solid material is sputtered from the surface of the target material with the help of ion bombardment or inert gas, and then deposited onto the surface of the substrate. Sputtering coating is the process of depositing solid materials onto the surface of a substrate using ion bombardment in a vacuum environment to form a thin film.
