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RF+ARC

RF magnetron sputtering is a physical vapor deposition (PVD) technology that uses RF power to generate plasma between the target and the substrate to achieve thin film deposition.

Our company's planar arc technology, combined with radio frequency magnetron sputtering technology, is widely used in the preparation of semiconductors, optoelectronic devices and various surface coatings. It has become one of the important technologies for thin film preparation due to its many advantages such as low deposition temperature, fast deposition speed, good uniformity of deposited thin films, and composition close to the target material composition.

Plane arc technology

The newly developed plane arc technology of our company has brought great benefits to vacuum coating. Using the plane arc technology, the film layer of the plated product is more uniform, more delicate and smooth.

Advanced Multi-arc Technology

Using arc plasma evaporation source, high-energy and high-density metal plasma is generated in a specific vacuum environment. Under the action of negative bias voltage on the workpiece, metal film can be plated on the surface of metal, ceramic, etc., and compound film such as TIN and TIC can be plated by introducing reaction gas. The film layer is dense and has good bonding strength.The equipment adopts 100-type multi-arc, with a large target surface and high coating coverage, which is conducive to color uniformity.

Advanced mold coating technology

Cemented carbide coating is an important progress in modern cemented carbide research and development technology.This technology uses a magnetic field to excite ions in a vacuum environment, so that atoms or molecules on the surface of the material gain enough energy to be released from the target and deposited on the substrate, providing a high-quality coating for the mold.

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